- Moving Probe Tester
Special Moving Probes Conduct High Speed / High Accuracy Testing
to Detect Faults on both sides of the Board
Phase Difference Measurement (PDM)
Phase Difference Measurement (PDM)
MicroCraft's independently developed testing method which exponentially speeds up both continuity/isolation tests. This method is most suitable for medium size production quantity.
Phase Difference Measurement (PDM) Unit
Phase Difference Measurement Unit (PDM) sends high frequency signal between the reference line (plane) and signal line to measure differences between these phases, which will cut down unnecessary isolation tests within the net. With fewer test points and test cycle compared to ordinary isolation test, the test speed have increased dramatically.
HVS (High Voltage Stress Test)
HVS (High Voltage Stress Test) is a measurement system that is capable of detecting high resistance isolation defect which was undetectable with Phase Difference Measurement (PDM). HVS is conducted by applying high voltage pulses between signal lines to detect high resistance defect. HVS similar to PDM, inspects each net once, thus achieves much faster test speed compared to ordinary isolation test by resistance measurement. This revolutionary testing method can be upgraded as an option to our EMMA series. Optional
High Voltage Isolation Resistance Measurement Unit
As to maximum applicable voltage with standard isolation resistance measurement is 250 V,
this offers the option of applying maximum of 500 V / 1000 V for highly reliable high resistance isolation test. Optional
Super High Resistance Isolation Measurement Unit
|Test Voltage||Test range|
Max. 10 GΩ
Max. 100 GΩ
This is an option to detect super high resistance isolation defect by applying lower test voltage. The usage of low voltage allows users to conduct super high resistance test without adding high stress on the tested boards. Optional
* Applicable for E4 and F2 models in our EMMA lineup.
Micro Short Detection
Sudden application of high voltage in isolation test may result in burning out of parts containing Micro Short.
This is caused by carbonized residue possibly reacting with moisture in the air or gases in the factory,
which causes the element to relapse as high resistance short error after the test is complete.
Our Micro-short test avoids such damage and trouble by applying a low voltage (less than 30V)
before gradually increasing the applying voltage.
Again, high resistance short between multiple layers of a board may possess the characteristics of semiconductor and capacitors.
These errors can also be detected in our test by reversing the polarity of high voltage.
Connection with External Meter
By connecting to external meter using GPIB interface or USB connection,
it is possible to work with super high resistance isolation measurement,
super high voltage measurement, and even detecting layer-short in LCR, diode, and coil pattern. Optional
34410A Digital Multimeter (USB)
|Keithley Instruments Inc.||
6487 Picoammeter (GPIB)
Precision Resistance Measurement Unit
A 4 wire, 4 points measurement method by Kelvin probe allows high accuracy testing by low resistance. Furthermore, measuring Buried Resistance and saving the measured values are also included. Optional
Min. Resolution: 0.001 mΩ
Also can check probe contact error
|0–4 mΩ||0.001 mΩ||0.4 mΩ–3 mΩ||150 mA||Kelvin Probe|
|0–40 mΩ||0.01 mΩ||2 mΩ–30 mΩ||125 mA||Kelvin Probe|
|0–400 mΩ||0.1 mΩ||30 mΩ–300 mΩ||125 mA||Kelvin Probe|
|0–4 Ω||1 mΩ||0.3 Ω–3 Ω||125 mA||Kelvin Probe|
|0–10 Ω||2.5 mΩ||0.5 Ω–8 Ω||10 mA|
|0–100 Ω||25 mΩ||5 Ω–80 Ω||10 mA|
|0–1000 Ω||250 mΩ||50 Ω–800 Ω||2.5 mA|
|0–10 kΩ||2.5 Ω||500 Ω–8 kΩ||0.25 mA|
|0–100 kΩ||25 Ω||5 kΩ–80 kΩ||25 µA||Buried Resistance|
|0–1 MΩ||250 Ω||50 kΩ–800 kΩ||2.5 µA||Buried Resistance|
Contact Check in Isolation Test
In order to improve isolation test accuracy, this feature enables users to verify probes are correctly in contact with the pad prior to testing. This contact check function effectively assist the user during pad search.
Latent test is the highest fault detection technology. Latent not only detects the existing defects, but also is capable of finding dormant ones having the possibility of becoming a permanent defect in the near future. This testing method enhances the product reliability. Optional
The pattern with “latent” or dormant defect, when applied with high current will induce temperature rise causing the output resistance to become nonlinear. This change shall be detected at high speed and accuracy and thus detect Latent defect.
|Specifications||ANALOG LF||ANALOG HF||DIGITAL|
1.46 MHz + 1.10 MHz
5 k–40 kHz Variable
|Drive voltage (Max.)||
0–30 V Variable
|Drive current (Max.)||
0–1.5 A Variable